| Datenblatt-Suchmaschine für elektronische Bauteile |
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AT24CSW01X Datenblatt(PDF) 35 Page - Microchip Technology |
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AT24CSW01X Datenblatt(HTML) 35 Page - Microchip Technology |
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35 / 41 page ![]() DRAWING NO. REV. TITLE GPC 4U-13 A 10/1/15 4U-13, 4-ball 2x2 Array, 0.40mm Pitch Wafer Level Chip Scale Package (WLCSP) with BSC GUJ COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN TYP MAX NOTE A 0.260 0.295 0.330 A1 — 0.070 — A2 — 0.225 — 3 D Contact Microchip for Details d1 0.400 BSC E Contact Microchip for Details e1 0.400 BSC b — 0.162 — PIN ASSIGNMENT MATRIX BOTTOM VIEW TOP VIEW SIDE VIEW 1 2 A B V CC SDA GND SCL d1 e1 E D b (4X) A2 A1 A k 0.075 C k 0.015 (4X) v d 0.015 C d 0.05 C A B A1 CORNER A1 CORNER SEATING PLANE B A 2 1 B A 1 2 d m m Note: 1. Dimensions are NOT to scale. 2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu. 3. Product offered with Back Side Coating (BSC) B A C Note: For the most current package drawings, please see the Microchip Packaging Specification located at http:// www.microchip.com/packaging. AT24CSW01X/AT24CSW02X Packaging Information © 2020-2021 Microchip Technology Inc. and its subsidiaries Datasheet DS20006396B-page 35 |
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