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NGTP25P140FST4G Datenblatt(PDF) 7 Page - ON Semiconductor |
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NGTP25P140FST4G Datenblatt(HTML) 7 Page - ON Semiconductor |
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7 / 10 page ![]() AND9068/D http://onsemi.com 6 Figure 7. Pin−to−pin Capacitances of the IGBT Cies + Cge ) Cgc with Cce shorted Coes + Cgc ) Cce Cres + Cgc Input Capacitance, Cies The input capacitance is made up of the parallel combination of gate−emitter and gate−collector capacitances, when the collector and emitter are tied together. The gate−emitter capacitance is constant, as it consists mainly of the metal−oxide−semiconductor capacitance. The gate−collector capacitance is a combination of a fixed oxide capacitor and a p−n junction capacitor. This results in a voltage dependence that is slightly more complex than that of a p−n junction. Output Capacitance, Coes The output capacitance is formed by the parallel combination of the gate−collector and collector−emitter capacitances. As mentioned above, the gate−collector capacitance is voltage dependant. This is also true for the collector−emitter capacitance. The voltage dependence of the collector−emitter junction is that of a p−n junction. Transfer Capacitance, Cres The transfer capacitance is composed only of the gate−collector capacitance. Its role in the device operation is critical, as it provides negative feedback between the collector and the gate. This capacitance is responsible for the plateau on the gate charge curve. The change in collector−emitter voltage forces a current through Cres which reduces the gate drive current while the collector voltage is changing. Gate Charge, Total, Qg Input capacitance is useful, but in terms of gate drive design, the more important figure of merit is the gate charge. It is used to size the gate drive components and predict switching losses in the driver. To measure gate charge the IGBT gate is driven with a current and the gate voltage change is monitored versus time. The resulting gate voltage versus gate charge curve is shown in Figure 8 for a constant current gate drive signal. Qg is the total charge required on the gate to raise VGE to a specified gate voltage. ON Semiconductor devices are specified at VGE_=_15_V. Figure 8. Theoretical Gate Charge Curve showing VGP, QG, QGE, and QGC Gate to Emitter Charge, Qge Qge is the amount of charge required to reach the plateau voltage VGP. This charge contributes to turning on the MOS channel, at which time the collector−emitter voltage begins to transition from high to low voltage. The level of VGP is dependent on the load current being switched and can be approximated by determining the VGS that corresponds to the switching current level from the transconductance curves in Figure 5. Gate to Collector Charge, Qgc Qgc is the amount of charge required to charge the junction capacitor while the voltage from collector to emitter is decreasing in the transition between the off−state and on−state. This plateau corresponds to the charging of what is also known as the Miller capacitance. Switching Characteristics The IGBT switching characteristics are of great importance because they relate directly to the switching energy losses of the device. Switching losses can be substantial, especially at higher frequencies and increasing temperature, where the switching losses increase. When voltage is applied to the gate, the input capacitance must first be charged to the threshold voltage, VGE(th). This leads to a delay (td(on)) before the IGBT collector current begins to flow. Once the collector current begins to flow, the depletion layer that blocks the voltage during the off−state begins to collapse. The voltage drops to the on−state voltage drop, VCE(sat). This is illustrated in Figure 9. During turn−off, the gate voltage is reduced to zero and the opposite occurs. The channel for the MOSFET current is closed and the current begins to drop abruptly. The voltage |
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