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NGTP25P140FST4G Datenblatt(PDF) 7 Page - ON Semiconductor

Teilenummer NGTP25P140FST4G
Bauteilbeschribung  Reading ON Semiconductor IGBT Datasheets
PDF  10 Pages
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Hersteller  ONSEMI [ON Semiconductor]
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NGTP25P140FST4G Datenblatt(HTML) 7 Page - ON Semiconductor

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Figure 7. Pin−to−pin Capacitances of the IGBT
Cies + Cge ) Cgc with Cce shorted
Coes + Cgc ) Cce
Cres + Cgc
Input Capacitance, Cies
The input capacitance is made up of the parallel
combination
of
gate−emitter
and
gate−collector
capacitances, when the collector and emitter are tied
together. The gate−emitter capacitance is constant, as it
consists mainly of the metal−oxide−semiconductor
capacitance. The gate−collector capacitance is a
combination of a fixed oxide capacitor and a p−n junction
capacitor. This results in a voltage dependence that is
slightly more complex than that of a p−n junction.
Output Capacitance, Coes
The output capacitance is formed by the parallel
combination of the gate−collector and collector−emitter
capacitances. As mentioned above, the gate−collector
capacitance is voltage dependant. This is also true for the
collector−emitter capacitance. The voltage dependence of
the collector−emitter junction is that of a p−n junction.
Transfer Capacitance, Cres
The transfer capacitance is composed only of the
gate−collector capacitance. Its role in the device operation
is critical, as it provides negative feedback between the
collector and the gate. This capacitance is responsible for the
plateau on the gate charge curve. The change in
collector−emitter voltage forces a current through Cres
which reduces the gate drive current while the collector
voltage is changing.
Gate Charge, Total, Qg
Input capacitance is useful, but in terms of gate drive
design, the more important figure of merit is the gate charge.
It is used to size the gate drive components and predict
switching losses in the driver. To measure gate charge the
IGBT gate is driven with a current and the gate voltage
change is monitored versus time. The resulting gate voltage
versus gate charge curve is shown in Figure 8 for a constant
current gate drive signal.
Qg is the total charge required on the gate to raise VGE to
a specified gate voltage. ON Semiconductor devices are
specified at VGE_=_15_V.
Figure 8. Theoretical Gate Charge Curve showing
VGP, QG, QGE, and QGC
Gate to Emitter Charge, Qge
Qge is the amount of charge required to reach the plateau
voltage VGP. This charge contributes to turning on the MOS
channel, at which time the collector−emitter voltage begins
to transition from high to low voltage. The level of VGP is
dependent on the load current being switched and can be
approximated by determining the VGS that corresponds to
the switching current level from the transconductance
curves in Figure 5.
Gate to Collector Charge, Qgc
Qgc is the amount of charge required to charge the junction
capacitor while the voltage from collector to emitter is
decreasing in the transition between the off−state and
on−state. This plateau corresponds to the charging of what
is also known as the Miller capacitance.
Switching Characteristics
The IGBT switching characteristics are of great
importance because they relate directly to the switching
energy losses of the device. Switching losses can be
substantial, especially at higher frequencies and increasing
temperature, where the switching losses increase.
When voltage is applied to the gate, the input capacitance
must first be charged to the threshold voltage, VGE(th). This
leads to a delay (td(on)) before the IGBT collector current
begins to flow. Once the collector current begins to flow, the
depletion layer that blocks the voltage during the off−state
begins to collapse. The voltage drops to the on−state voltage
drop, VCE(sat). This is illustrated in Figure 9.
During turn−off, the gate voltage is reduced to zero and
the opposite occurs. The channel for the MOSFET current
is closed and the current begins to drop abruptly. The voltage



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