FEDL7732-01-10

OKI Semiconductor

MSM7732-01

26/29

P-LFBGA48-0707-0.80

Package material

Epoxy resin

Package weight (g)

0.12 TYP.

5

Rev. No./Last Revised

1/Jun. 20, 2001

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,

package name, pin number, package code and desired mounting conditions (reflow method, temperature and

times).

(Unit: mm)