ADP221ACBZ2828-R7 datasheet(5/20 Pages) AD

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Data Sheet

ADP220/ADP221

Rev. H | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

–0.3 V to +6.5 V

VOUT1, VOUT2 to GND

–0.3 V to VIN

EN1, EN2 to GND

–0.3 V to +6.5 V

Storage Temperature Range

–65°C to +150°C

Operating Junction Temperature Range

–40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

The ADP220/ADP221 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient temper-

ature does not guarantee that the junction temperature (TJ)

is within the specified temperature limits. In applications

with high power dissipation and poor thermal resistance, the

maximum ambient temperature may have to be derated. In

applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature (TJ) of

the device is dependent on the ambient temperature (TA), the

power dissipation of the device (PD), and the junction-to-ambient

thermal resistance of the package (θJA). Maximum junction

temperature (TJ) is calculated from the ambient temperature

(TA) and power dissipation (PD) using the following formula:

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent

on the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending

on PCB material, layout, and environmental conditions. The

specified values of θJA are based on a four-layer, 4 inch × 3 inch,

circuit board. Refer to JEDEC JESD 51-9 for detailed informa-

tion on the board construction. For additional information,

see the AN-617 Application Note, MicroCSPTM

Wafer Level Chip

Scale Package.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Package Thermal Information, states

that thermal characterization parameters are not the same as

thermal resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation

from the package. Factors that make ΨJB more useful in real-

world applications. Maximum junction temperature (TJ) is

calculated from the board temperature (TB) and power

dissipation (PD) using the following formula:

TJ = TB + (PD × ΨJB)

Refer to JEDEC JESD51-8 and JESD51-12 for more detailed

information on ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4.

Package Type

θJA

ΨJB

Unit

6-Ball, 0.5 mm Pitch WLCSP

260

43.8

°C/W

6-Ball Bumped Bare Die

260

43.8

°C/W

ESD CAUTION

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