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ADP221ACBZ2828-R7 Datenblatt(PDF) 17 Page - Analog Devices |
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ADP221ACBZ2828-R7 Datenblatt(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() Data Sheet ADP220/ADP221 Rev. H | Page 17 of 20 OUTLINE DIMENSIONS A B C 0.675 0.595 0.515 0.380 0.355 0.330 0.270 0.240 0.210 1.000 0.950 0.900 1.500 1.450 1.400 1 2 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) SIDE VIEW 0.345 0.295 0.245 1.00 REF 0.50 BSC BALL A1 IDENTIFIER SEATING PLANE 0.50 BSC COPLANARITY 0.075 Figure 42. 6-Ball Wafer Level Chip Scale Package [WLCSP] (CB-6-2) Dimensions show in millimeters 0.50 REF 1.00 REF 1.50 1.46 1.42 1.00 0.96 0.92 0.50 REF A 1 2 B C TOP VIEW (BALL SIDE DOWN) BOTTOM VIEW (BALL SIDE UP) BALL A1 IDENTIFIER 0.225 NOM 0.09 NOM 0.330 0.315 0.300 END VIEW 0.200 0.170 0.140 COPLANARITY 0.05 NOM SEATING PLANE Figure 43. 6-Ball Bumped Bare Die Sales [BUMPED_CHIP] (CD-6-7) Dimensions show in millimeters |
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