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ADP221ACBZ2828-R7 Datenblatt(PDF) 16 Page - Analog Devices |
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ADP221ACBZ2828-R7 Datenblatt(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() ADP220/ADP221 Data Sheet Rev. H | Page 16 of 20 PRINTED CIRCUIT BOARD (PCB) LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP220/ADP221. However, as shown in Table 6, a point of diminishing returns eventually is reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitors as close as possible to the VOUT1, VOUT2, and GND pins. Use 0402 or 0603 size capacitors and resistors to achieve the smallest possible footprint solution on boards where area is limited. Figure 40. Example of PCB Layout, Top Side Figure 41. Example of PCB Layout, Bottom Side |
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