PA62 datasheet(4/4 Pages) APEX

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APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739

This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All speciﬁcations are subject to change without notice.

TYPICAL APPLICATION (CONT.)

The PA62 can be used in a three ampliﬁer conﬁguration for

a three phase inverter or motor as shown in Figure 4.

FIGURE 4. 3 Phase Inverter

GENERAL

Please read Application Note 1 "General Operating Consider-

ations" which covers stability, supplies, heatsinking, mounting,

SOA interpretation, and speciﬁcation interpretation. Visit www.

apexmicrotech.com for design tools that help automate tasks

such as calculations for stability, internal power dissipation,

heatsink selection; Apex's complete Application Notes library;

Technical Seminar Workbook; and Evaluation Kits.

STABILITY CONSIDERATIONS

All monolithic power op amps use output stage topologies

that present special stability problems. This is primarily due to

non-complementary (both devices are NPN) output stages with

a mismatch in gain and phase response for different polarities

of output current. It is difﬁcult for the op amp manufacturer to

optimize compensation for all operating conditions.

GENERAL

CONSIDERATIONS

PA62

SAFE OPERATING AREA (SOA)

The SOA curves combine the effect of all limits for this power

op amp. For a given application, the direction and magnitude

of the output current should be calculated or measured and

checked against the SOA curves. This is simple for resistive

loads but more complex for reactive and EMF generating

loads. The following guidelines may save extensive analyti-

cal efforts.

THERMAL CONSIDERATIONS

The PA62DK has a large exposed integrated copper heatslug

to which the monolithic is directly attached. The solder connec-

tion of the heatslug to a minimum of 1 square inch foil area of

the printed circuit board will result in thermal performance of

25°C/W junction to air rating of the PA62DK. Solder connec-

tion to an area of 1 to 2 square inches of foil is required for

minimal power applications

Where the PA62DK is used in higher power applications,

it is necessary to use surface mount techniques of heatsink-

ing. Surface mount techniques include the use of a surface

mount fan in combination with a surface mount heatsink on

the backside of the FR4/ PC board with through hole thermal

vias. Other highly thermal conductive substrate board materials

are available for maximum heat sinking.

The Power Derating graph shown below assumes that the

power dissipation is equal in each of the ampliﬁers. Power and

thermal ratings are based on two separate dual monolithic

power op amps on one integrated copper heat slug. Amps A

and B are combined on one monolithic die while amps C and

D are combined on the other. This multi chip conﬁguration

provides superior thermal performance by isolating each of

the dual ampliﬁers. When loading either of the dual ampliﬁers

it is possible to achieve better thermal performance by loading

any combination of ampliﬁers (A or B) + (C or D).

MOUNTING PRECAUTIONS

1. Always use a heat sink. Even unloaded the PA62DK can

dissipate up to .8 watts.

2. Avoid bending the leads. Such action can lead to internal

damage.

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