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M24256E-F Datenblatt(PDF) 32 Page - STMicroelectronics

Teilenummer M24256E-F
Bauteilbeschribung  256-Kbit serial I2C bus EEPROM with configurable device address
PDF  46 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24256E-F Datenblatt(HTML) 32 Page - STMicroelectronics

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10
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
10.1
SO8N package information
This SO8N is an 8-lead, 4.9 x 6 mm, plastic small outline, 150 mils body width, package.
Figure 20. SO8N – Outline
E1
8
ccc
b
D
c
1
E
h x 45˚
A2
k
0.25 mm
L
A1
GAUGE PLANE
e
A
L1
C
SEATING
PLANE
Package SO8N (package code O7)
1.
Drawing is not to scale.
Table 14. SO8N – Mechanical data
Symbol
millimeters
inches (1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
1.750
-
-
0.0689
A1
0.100
-
0.250
0.0039
-
0.0098
A2
1.250
-
-
0.0492
-
-
b
0.280
-
0.480
0.0110
-
0.0189
c
0.100
-
0.230
0.0039
-
0.0091
D(2)
4.800
4.900
5.000
0.1890
0.1929
0.1969
E
5.800
6.000
6.200
0.2283
0.2362
0.2441
E1(3)
3.800
3.900
4.000
0.1496
0.1535
0.1575
e
-
1.270
-
-
0.0500
-
h
0.250
-
0.500
0.0098
-
0.0197
k
-
-
L
0.400
-
1.270
0.0157
-
0.0500
L1
-
1.040
-
-
0.0409
-
ccc
-
-
0.100
-
-
0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15 mm per side
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per
side.
M24256E-F
Package information
DS12687 - Rev 2
page 32/46



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