ISL81601 datasheet(46/54 Pages) RENESAS

Teilenummer	ISL81601

Bauteilbeschribung	60V Bidirectional 4-Switch Synchronous Buck-Boost Controller

PDF	54 Pages

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Hersteller	RENESAS [Renesas Technology Corp]

Direct Link	http://www.renesas.com

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46 / 54 page

FN9299 Rev.3.1

Page 46 of 53

May 27, 2021

ISL81601

7. Layout Guidelines

(12) Use a pair of traces with minimum loop for the input or output current sensing connection.

(13) Ensure the feedback connection to the output capacitor is short and direct.

7.2

General EPAD Design Considerations

Figure 56 illustrates how to use vias to remove heat from the IC.

Figure 56. PCB Via Pattern

Fill the thermal pad area with vias. A typical via array fills the thermal pad footprint so that their centers are three

times the radius apart from each other. Keep the vias small but not so small that their inside diameter prevents

solder wicking through during reflow.

Connect all vias to the ground plane. The vias must have a low thermal resistance for efficient heat transfer. Ensure

a complete connection of the plated through hole to each plane.

ISL81601 Datenblatt(PDF) 46 Page - Renesas Technology Corp