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BAS70W Datenblatt(PDF) 13 Page - NXP Semiconductors |
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BAS70W Datenblatt(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page ![]() BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 13 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 19. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD882 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste MBL872 1.30 0.30 R = 0.05 (8 ×) R = 0.05 (8 ×) 0.60 (2 ×) 0.70 (2 ×) 0.80 (2 ×) solder lands solder resist occupied area solder paste 0.90 0.30 (2 ×) 0.40 (2 ×) 0.50 (2 ×) |
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