| Datenblatt-Suchmaschine für elektronische Bauteile |
|
BAS70W Datenblatt(PDF) 16 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
BAS70W Datenblatt(HTML) 16 Page - NXP Semiconductors |
|
16 / 20 page ![]() BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 16 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Dimensions in mm Fig 25. Reflow soldering footprint SOT363 (SC-88) Fig 26. Wave soldering footprint SOT363 (SC-88) MSA432 solder lands solder resist occupied area solder paste 1.20 2.40 0.50 (4 ×) 0.40 (2 ×) 0.90 2.10 0.50 (4 ×) 0.60 (2 ×) 2.35 2.65 solder lands solder resist occupied area 1.15 3.75 transport direction during soldering 1.00 0.30 4.00 4.50 5.25 sot363 Dimensions in mm |
|
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |