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TMS320VC33 Datenblatt(PDF) 24 Page - Texas Instruments

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Teilenummer TMS320VC33
Bauteilbeschribung  DIGITAL SIGNAL PROCESSOR
PDF  57 Pages
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
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TMS320VC33 Datenblatt(HTML) 24 Page - Texas Instruments

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TMS320VC33
DIGITAL SIGNAL PROCESSOR
SPRS087E − FEBRUARY 1999 − REVISED JANUARY 2004
24
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
device and development support tool nomenclature (continued)
PREFIX
TMS
320
VC 33 PGE
TMX = experimental device
TMP = prototype device
TMS = qualified device
SMJ = MIL-PRF-38535
SM = High Rel (non-38535)
DEVICE FAMILY
320 = TMS320 Family
TECHNOLOGY
PACKAGE TYPE†
N
= plastic DIP
J
= ceramic DIP
JD
= ceramic DIP side-brazed
GB
= ceramic PGA
FZ
= ceramic CC
FN
= plastic leaded CC
FD
= ceramic leadless CC
PJ
= 100-pin plastic EIAJ QFP
PZ
= 100-pin plastic LQFP
PBK = 128-pin plastic LQFP
PQ
= 132-pin plastic bumpered QFP
PGE = 144-pin plastic LQFP
GGU = 144-pin MicroStar BGA
PGF = 176-pin plastic LQFP
GGW= 176-pin MicroStar BGA
C = CMOS
E = CMOS EPROM
F = CMOS Flash EEPROM
LC = Low-Voltage CMOS (3.3 V)
VC = Low-Voltage CMOS [3 V (2.5 V
or 1.8 V core)]
UC= Ultra Low-Voltage CMOS [1.8 V
(1.5 V core)]
DEVICE
1x DSP
= TMS320C1x DSP Generation
2x DSP
= TMS320C2x DSP Generation
3x DSP
= TMS320C3x DSP Generation
4x DSP
= TMS320C4x DSP Generation
5x DSP
= TMS320C5x DSP Generation
54x DSP = TMS320C54x DSP Generation
6x DSP
= TMS320C6x DSP Generation
† DIP = Dual-In-Line Package
PGA = Pin Grid Array
CC = Chip Carrier
QFP = Quad Flat Package
LQFP = Low-Profile Quad Flat Package
BGA = Ball Grid Array
120
SPEED
120 = 120 MFLOPS
150 = 150 MFLOPS
Figure 14. TMS320
 DSP Device Nomenclature
MicroStar BGA is a trademark of Texas Instruments.



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