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TLE8262E Datenblatt(PDF) 9 Page - Infineon Technologies AG

Teilenummer TLE8262E
Bauteilbeschribung  Universal System Basis Chip HERMES Rev. 1.0
PDF  93 Pages
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Hersteller  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

TLE8262E Datenblatt(HTML) 9 Page - Infineon Technologies AG

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Data Sheet
9
Rev. 1.0, 2009-03-31
TLE8262E
Pin Configuration
26
RxDLIN
LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1
as well as SAE J2602-2; push-pull output; LOW in dominant state.
27
n.c.
Not connected
28
n.c.
Not connected
29
n.c.
Not connected
30
n.c.
Not connected
31
GND
Ground
32
n.c.
Not connected
33
n.c
not connected
34
WK
Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals
coming from, for example, an external switch panel; also used as wake-up input;
35
Limp Home
Fail-Safe Function Output; Open drain. Active LOW.
36
Test
SBC SW Development Mode entry; Connect to GND for activation; Integrated pull-
up resistor. Connect to
V
S or leave open for normal operation.
EDP
-
Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.1)
1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed
die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC
performance.
Pin
Symbol
Function



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