MPC8536BVTATH datasheet(113/128 Pages) FREESCALE

113 / 128 page

Thermal

MPC8536E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2

Freescale Semiconductor

113

2.24.3

Thermal Management Information

This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for

air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,

and thermal interface material.

The recommended attachment method to the heat sink is illustrated in Figure 73. The heat sink should be attached to the

printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45

Newton).

Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options

The system board designer can choose between several types of heat sinks to place on the device. Ultimately, the final selection

of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,

attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha

Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient

thermal resistances, that will allow the MPC8536E to function in various environments.

2.24.3.1

Internal Package Conduction Resistance

For the packaging technology, shown in Table 70, the intrinsic internal conduction thermal resistance paths are as follows:

•

The die junction-to-case thermal resistance

•

The die junction-to-board thermal resistance

Thermal Interface Material

Heat Sink

FC-PBGA Package

Heat Sink

Clip

Printed-Circuit Board

Die

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