LPC1313 datasheet(3/53 Pages) NXP

3 / 53 page

LPC1311_13_42_43_1

Product data sheet

Rev. 01 — 11 December 2009

3 of 53

NXP Semiconductors

LPC1311/13/42/43

32-bit ARM Cortex-M3 microcontroller

Ordering information

4.1 Ordering options

Table 1.

Ordering information

Type number

Package

Name

Description

Version

LPC1311FHN33 HVQFN33

HVQFN33: plastic thermal enhanced very thin quad ﬂat package; no leads;

33 terminals; body 7 x 7 x 0.85 mm

n/a

LPC1313FBD48 LQFP48

LQFP48: plastic low proﬁle quad ﬂat package; 48 leads; body7x7x1.4 mm SOT313-2

LPC1313FHN33 HVQFN33

HVQFN33: plastic thermal enhanced very thin quad ﬂat package; no leads;

33 terminals; body 7 x 7 x 0.85 mm

n/a

LPC1342FHN33 HVQFN33

HVQFN33: plastic thermal enhanced very thin quad ﬂat package; no leads;

33 terminals; body 7 x 7 x 0.85 mm

n/a

LPC1343FBD48 LQFP48

LQFP48: plastic low proﬁle quad ﬂat package; 48 leads; body7x7x1.4 mm SOT313-2

LPC1343FHN33 HVQFN33

HVQFN33: plastic thermal enhanced very thin quad ﬂat package; no leads;

33 terminals; body 7 x 7 x 0.85 mm

n/a

Table 2.

Ordering options for LPC1311/13/42/43

Type number

Flash

Total

SRAM

USB

UART

RS-485

I2C/

Fast+

SSP

ADC

channels

Pins

Package

LPC1311FHN33

8 kB

4 kB

HVQFN33

LPC1313FBD48

32 kB

8 kB

LQFP48

LPC1313FHN33

32 kB

8 kB

HVQFN33

LPC1342FHN33

16 kB

4 kB

Device

HVQFN33

LPC1343FBD48

32 kB

8 kB

Device

LQFP48

LPC1343FHN33

32 kB

8 kB

Device

HVQFN33

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