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LPC1313 Datenblatt(PDF) 49 Page - NXP Semiconductors |
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LPC1313 Datenblatt(HTML) 49 Page - NXP Semiconductors |
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49 / 53 page ![]() LPC1311_13_42_43_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 11 December 2009 49 of 53 NXP Semiconductors LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller Fig 31. Package outline (HVQFN33) References Outline version European projection Issue date IEC JEDEC JEITA - - - hvqfn33_po 09-03-17 09-03-23 Unit mm max nom min 1.00 0.85 0.80 0.05 0.02 0.00 0.2 7.1 7.0 6.9 4.85 4.70 4.55 7.1 7.0 6.9 0.65 4.55 0.75 0.60 0.45 0.1 A(1) Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 x 7 x 0.85 mm A1 b 0.35 0.28 0.23 cD(1) Dh E(1) Eh 4.85 4.70 4.55 ee1 e2 4.55 Lv 0.1 w 0.05 y 0.08 y1 0 2.5 5 mm scale terminal 1 index area B A D E C y C y1 X detail X A1 A c b e2 e1 e e A C B v C w terminal 1 index area Dh Eh L 9 16 32 33 25 17 24 8 1 |
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