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ADS58C48IPFPR Datenblatt(PDF) 3 Page - Texas Instruments |
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ADS58C48IPFPR Datenblatt(HTML) 3 Page - Texas Instruments |
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3 / 70 page ![]() ADS58C48 www.ti.com SLAS689 – MAY 2010 PACKAGE/ORDERING INFORMATION(1) SPECIFIED TRANSPORT PACKAGE- PACKAGE LEAD/BALL PACKAGE ORDERING PRODUCT TEMPERATURE ECO PLAN (2) MEDIA, LEAD DESIGNATOR FINISH MARKING NUMBER RANGE QUANTITY ADS58C48 TQFP-80 PFP –40°C to 85°C GREEN (RoHS Cu NiPdAu ADS58C48I ADS58C48IPFP Tray and no Sb/Br) ADS58C48IPFPR Tape & reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com (2) Eco Plan is the planned eco-friendly classification. Green (RoHS, no Sb/Br): TI defines Green to mean Pb-Free (RoHS compatible) and free of Bromine- (Br) and Antimony- (Sb) based flame retardants. Refer to the Quality and Lead-Free (Pb-Free) Data web site for more information ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT Supply voltage range, AVDD –0.3 V to 2.1 V V Supply voltage range, DRVDD –0.3 V to 2.1 V V Voltage between AGND and DRGND –0.3 V to 0.3 V V Voltage between AVDD to DRVDD (when AVDD leads DRVDD) –2.4 V to +2.4 V V Voltage between DRVDD to AVDD (when DRVDD leads AVDD) –2.4 V to +2.4 V V Voltage applied to input pins INP, INM –0.3 V to minimum ( 1.9, AVDD + 0.3 V ) V CLKP, CLKM(2) -0.3 V to AVDD + 0.3 V RESET, SCLK, SDATA, SEN, SNRB_1, –0.3 V to 3.9 V SNRB_2, PDN Operating free-air temperature range, TA –40 to 85 °C Operating junction temperature range, TJ 125 °C Storage temperature range, Tstg –65 to 150 °C ESD, human body model 2 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (2) When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is < |0.3V|. This prevents the ESD protection diodes at the clock input pins from turning on. THERMAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TYPICAL VALUE UNIT RqJA (2) Soldered thermal pad, no airflow 24 °C/W Soldered thermal pad, 200 LFM 16 °C/W RqJC (3) Bottom of package (thermal pad) 0.3 °C/W (1) With a JEDEC standard high K board and 5x5 via array. See the Exposed Pad section in the Application Information. (2) RqJA is the thermal resistance from the junction to ambient (3) RqJC is the thermal resistance from the junction to the thermal pad. Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s) :ADS58C48 |
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