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LM27402 Datenblatt(PDF) 20 Page - National Semiconductor (TI) |
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LM27402 Datenblatt(HTML) 20 Page - National Semiconductor (TI) |
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20 / 32 page ![]() 30092624 FIGURE 17. VDD Charge Pump Circuit The circuit in Figure 17 will effectively supply close to the VDD voltage (4.5V) between the gate and the source of the high- side MOSFET during the on time. It is recommended to use a Schottky diode for D BOOT with sufficient reverse standoff voltage and continuous current rating. The average current through this diode is dependent on the gate charge of the high-side FET and the frequency. It can be calculated using the following equation I DBOOT is the average current through the DBOOT diode, fSW (Hz) is the switching frequency and Q GHS (C) is the gate charge of the high-side MOSFET. If the input voltage is below 5.5V, it is recommended to connect VDD to the input supply of the LM27402 through a 1 Ω resistor shown in Figure 18. This will increase the gate voltage of both the low-side and high-side FETs. 30092632 FIGURE 18. Tie V DD to VIN when VIN ≤ 5.5V POWER / EFFICIENCY CALCULATIONS The overall efficiency of a buck regulator is simply the ratio of output power to input power. Accurately predicting the overall efficiency can be tedious and depends on many variables. Although power losses can be found in almost every compo- nent of a buck regulator, the following sections present equa- tions detailing components with the highest relative power loss. MOSFETS Selecting the correct MOSFET for a design is important to the overall operation of the circuit. If inappropriate FETs are se- lected for the application, it can result in poor efficiency, high temperature issues, shoot-through and other impairments. It is important to calculate the power dissipation for each MOS- FET at the maximum output current and make sure the max- imum allowable power dissipation is not exceeded. MOSFET datasheets should also specify a junction-to-ambient thermal resistance ( θ JA) so the temperature rise can be estimated from this specification . Both high-side and low-side FETs contribute significant loss to the system relative to the other components. The high-side FET contributes transition switching losses, conduction loss- es and gate charge losses. The low-side FET also contributes conduction and gate charge losses, but the FET body diode voltage drop during deadtime and reverse recovery loss must also be considered. The transition losses for the low-side FET are small and usually ignored. High-Side MOSFET The next set of equations can be used to calculate the losses associated with the high-side FET. P CND_HS is the conduction loss of the high-side FET during the D cycle when current is flowing through the FET on-resis- tance. A self heating coefficient of 1.3 is included in this equation to approximate the effects of the R DS(ON) tempera- ture coefficient. R DS(ON)_HS (Ω) is the drain to source resis- tance, I OUT (A) is the output current and D is the duty ratio. P SW_HS is the switching power loss during the high-side FET transition time. V IN (V) is the input voltage, fSW (Hz) is the switching frequency, and t r and tf (s) are the rise and fall times of the switch-node voltage respectively. P TOT_HS is the total power dissipation of the high-side FET. The gate charge of the high-side MOSFET can greatly affect the turn-on transition time and therefore efficiency. Further- more, it is wise to consider the ratio of switching loss to conduction loss associated with the high-side FET. If the duty ratio is small and the input voltage is high, it may be beneficial to tradeoff Q G for higher RDS(ON) to avoid high switching losses relative to conduction losses. If the duty ratio is large and the input voltage is low, then a lower R DS(ON) FET in tandem with a higher Q G may result in less power dissipation. Low-Side MOSFET The next set of equations can be used to calculate the losses due to the low-side FET. www.national.com 20 |
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