SSM2804CBZ-R7 datasheet(36/36 Pages) AD

36 / 36 page

SSM2804

Rev. 0 | Page 36 of 36

OUTLINE DIMENSIONS

0.660

0.600

0.540

3.000

2.960

2.920

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

SIDE VIEW

0.270

0.240

0.210

0.390

0.360

0.330

0.360

0.320

0.280

2.00

REF

2.50 REF

BALL A1

IDENTIFIER

COPLANARITY

0.05

SEATING

PLANE

2.500

2.460

2.420

0.50

BALL PITCH

Figure 40. 30-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-30-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM2804CBZ-RL

−40°C to +85°C

30-Ball Wafer Level Chip Scale Package [WLCSP]

CB-30-4

SSM2804CBZ-R7

−40°C to +85°C

30-Ball Wafer Level Chip Scale Package [WLCSP]

CB-30-4

EVAL-SSM2804Z

Evaluation Board

1 Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

registered trademarks are the property of their respective owners.

D09960-0-7/11(0)

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