TUSB8020A, TUSB8040A

SLLSEA7B – MAY 2012 – REVISED AUGUST 2012

www.ti.com

6

ELECTRICAL SPECIFICATIONS

6.1

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

-0.3 to 3.8

Supply voltage

V

-0.3 to 1.4

Storage temperature range

-65 to 150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Expose to absolute-maximum-rated conditions for extended periods may affect device reliability

6.2

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

3

3.3

3.6

Supply voltage

V

1.045

1.100

1.26

Operating free-air temperature range

-40

25

85

°C

Operating junction temperature range

-40

25

105

°C

6.3

THERMAL INFORMATION

TUSB8040A

TUSB8040A

THERMAL METRIC

PFP

RKM

UNITS

80 PINS

100 PINS

24.8

25.6

21.5

9.5

8.37

15.2

°C/W

0.5

0.1

8.2

7.5

1.6

0.4

(1)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(2)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(4)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(5)

The junction-to-board characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

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32

ELECTRICAL SPECIFICATIONS

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