TM124FBK32F, TM124FBK32U 1048576 BY 32-BIT DYNAMIC RAM MODULE

TM248GBK32F, TM248GBK32U 2097152 BY 32-BIT DYNAMIC RAM MODULE

SMMS660 – MARCH 1996

3

POST OFFICE BOX 1443

Table 1. Connection Table

DATA BLOCK

RASx

CASx

DATA BLOCK

SIDE 1

SIDE 2†

CASx

DQ0 – DQ7

RAS0

RAS1

CAS0

DQ8 – DQ15

RAS0

RAS1

CAS1

DQ16 – DQ23

RAS2

RAS3

CAS2

DQ24 – DQ31

RAS2

RAS3

CAS3

† Side 2 applies to the TM248GBK32F and the TM248GBK32U.

single in-line memory module and components

PC substrate: 1,27

± 0,1 mm (0.05 inch) nominal thickness; 0.005 inch/inch maximum warpage

Bypass capacitors: Multilayer ceramic

Contact area for TM124FBK32F and TM248GBK32F: Nickel plate and gold plate over copper

Contact area for TM124FBK32U and TM248GBK32U: Nickel plate and tin/lead over copper

functional block diagram ( TM124FBK32F and TM248GBK32F, side 1)

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

A0 – A9

DQ8 – DQ15

DQ24 – DQ31

W

RAS0

CAS0

CAS1

RAS2

10

10

10

DQ0 – DQ7

DQ16 – DQ23

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

CAS2

CAS3

functional block diagram ( TM248GBK32F, side 2 )

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

A0 – A9

DQ0 – DQ7

DQ16 – DQ23

W

RAS1

CAS1

CAS0

RAS3

10

10

10

DQ8 – DQ15

DQ24 – DQ31

1M

× 16

A0 –A9

DQ0 –

RAS

DQ7

W

LCAS

DQ8 –

UCAS

DQ15

CAS3

CAS2