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TM124FBK32F Datenblatt(PDF) 7 Page - Texas Instruments |
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TM124FBK32F Datenblatt(HTML) 7 Page - Texas Instruments |
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7 / 9 page ![]() TM124FBK32F, TM124FBK32U 1048576 BY 32-BIT DYNAMIC RAM MODULE TM248GBK32F, TM248GBK32U 2097152 BY 32-BIT DYNAMIC RAM MODULE SMMS660 – MARCH 1996 7 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 timing requirements over recommended ranges of supply voltage and operating free-air temperature (continued) ’124FBK32F - 60 ’248GBK32F - 60 ’124FBK32F - 70 ’248GBK32F - 70 ’124FBK32F - 80 ’248GBK32F - 80 UNIT MIN MAX MIN MAX MIN MAX tRWL Setup time, W low before RAS high 10 12 15 ns tWCS Setup time, W low before CAS low 0 0 0 ns tCAH Hold time, column address after CAS low 10 15 15 ns tDH Hold time, data after CAS low 10 15 15 ns tRAH Hold time, row address after RAS low 10 10 10 ns tRCH Hold time, W high after CAS high (see Note 9) 0 0 0 ns tRRH Hold time, W high after RAS high (see Note 9) 0 0 0 ns tWCH Hold time, W low after CAS low 10 15 15 ns tRHCP Hold time, RAS high from CAS precharge 35 40 45 ns tCHS Hold time, CAS low after RAS high (self refresh) – 50 – 50 – 50 ns tCHR Delay time, RAS low to CAS high (CBR refresh only) 10 10 10 ns tCRP Delay time, CAS high to RAS low 5 5 5 ns tCSR Delay time, CAS low to RAS low (CBR refresh only) 5 5 5 ns tRAD Delay time, RAS low to column address (see Note 10) 15 30 15 35 15 40 ns tRAL Delay time, column address to RAS high 30 35 40 ns tCAL Delay time, column address to CAS high 20 25 30 ns tRCD Delay time, RAS low to CAS low (see Note 10) 20 45 20 52 20 60 ns tRPC Delay time, RAS high to CAS low (CBR only) 0 0 0 ns tRSH Delay time, CAS low to RAS high 10 12 15 ns tREF Refresh time interval 16 16 16 ms tT Transition time 2 30 2 30 2 30 ns NOTES: 9. Either tRRH or tRCH must be satisfied for a read cycle. 10. The maximum value is specified only to assure access time. |
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