| Datenblatt-Suchmaschine für elektronische Bauteile |
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CBTL06DP212 Datenblatt(PDF) 18 Page - NXP Semiconductors |
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CBTL06DP212 Datenblatt(HTML) 18 Page - NXP Semiconductors |
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18 / 19 page ![]() NXP Semiconductors CBTL06DP212 High-performance DisplayPort Gen2 2 : 1 multiplexer © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 November 2011 Document identifier: CBTL06DP212 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Functional description . . . . . . . . . . . . . . . . . . . 6 8.1 Multiplexer/switch select functions . . . . . . . . . . 6 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Recommended operating conditions. . . . . . . . 7 11 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11.1 General characteristics . . . . . . . . . . . . . . . . . . . 8 11.2 DisplayPort channel characteristics . . . . . . . . . 8 11.3 AUX and DDC ports . . . . . . . . . . . . . . . . . . . . . 9 11.4 HPDIN input, HPD_x outputs . . . . . . . . . . . . . . 9 11.5 GPU_SEL and DDC_AUX_SEL inputs. . . . . . . 9 12 Application information. . . . . . . . . . . . . . . . . . 10 12.1 Special considerations . . . . . . . . . . . . . . . . . . 10 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Soldering of SMD packages . . . . . . . . . . . . . . 12 14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 12 14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 12 14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 14.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 17.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17.4 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17.5 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 18 Contact information. . . . . . . . . . . . . . . . . . . . . 17 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 |
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