STM32F103RG datasheet(14/120 Pages) STMICROELECTRONICS

14 / 120 page

Description

STM32F103xF, STM32F103xG

14/120

Doc ID 16554 Rev 3

2.2

Full compatibility throughout the family

The STM32F103xx is a complete family whose members are fully pin-to-pin, software and

feature compatible. In the reference manual, the STM32F103x4 and STM32F103x6 are

identified as low-density devices, the STM32F103x8 and STM32F103xB are referred to as

medium-density devices, the STM32F103xC, STM32F103xD and STM32F103xE are

referred to as high-density devices and the STM32F103xF and STM32F103xG are called

XL-density devices.

Low-density, high-density and XL-density devices are an extension of the STM32F103x8/B

medium-density devices, they are specified in the STM32F103x4/6, STM32F103xC/D/E and

STM32F103xF/G datasheets, respectively. Low-density devices feature lower Flash

memory and RAM capacities, less timers and peripherals. High-density devices have higher

Flash memory and RAM capacities, and additional peripherals like SDIO, FSMC, I2S and

DAC. XL-density devices bring even more Flash and RAM memory, and extra features,

namely an MPU, a greater number of timers and a dual bank Flash structure while

remaining fully compatible with the other members of the family.

The STM32F103x4, STM32F103x6, STM32F103xC, STM32F103xD, STM32F103xE,

STM32F103xF and STM32F103xG are a drop-in replacement for the STM32F103x8/B

devices, allowing the user to try different memory densities and providing a greater degree

of freedom during the development cycle.

Moreover, the STM32F103xx performance line family is fully compatible with all existing

STM32F101xx access line and STM32F102xx USB access line devices.

Table 3.

STM32F103xx family

Pinout

Low-density

devices

Medium-density

devices

High-density devices

XL-density devices

16 KB

Flash

32 KB

Flash(1)

64 KB

Flash

128 KB

Flash

256 KB

Flash

384 KB

Flash

512 KB

Flash

768 KB Flash

1 MB Flash

6 KB

RAM

10 KB

RAM

20 KB

RAM

20 KB

RAM

48 or

64 KB(2)

RAM

64 KB

RAM

64 KB

RAM

96 KB RAM

144

5 × USARTs

4 × 16-bit timers,

2 × basic timers

3 × SPIs, 2 × I2Ss, 2 × I2Cs

USB, CAN, 2 × PWM timers

3 × ADCs, 2 × DACs,

1 × SDIO

FSMC (100- and 144-pin

packages(3))

5 × USARTs

10 × 16-bit timers,

2 × basic timers

3 × SPIs, 2 × I2Ss, 2 × I2Cs

USB, CAN, 2 × PWM timers

3 × ADCs, 2 × DACs, 1 × SDIO,

Cortex-M3 with MPU

FSMC (100- and 144-pin

packages(4)), dual bank Flash

memory

100

3 × USARTs

3 × 16-bit timers

2 × SPIs, 2 × I2Cs,

USB, CAN,

1 × PWM timer

2 × ADCs

2 × USARTs

2 × 16-bit timers

1 × SPI, 1 × I2C,

USB, CAN,

1 × PWM timer

2 × ADCs

For orderable part numbers that do not show the A internal code after the temperature range code (6 or 7), the reference

datasheet for electrical characteristics is that of the STM32F103x8/B medium-density devices.

64 KB RAM for 256 KB Flash are available on devices delivered in CSP packages only.

Ports F and G are not available in devices delivered in 100-pin packages.

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