USB2533 datasheet(18/61 Pages) SMSC

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USB 2.0 Hi-Speed 3-Port Hub Controller

Datasheet

Revision 1.0 (06-17-13)

SMSC USB2533

DATASHEET

Note 3.2

The LOCAL_PWR pin is sampled during the configuration state, immediately after negation

of reset, to determine whether the device is bus-powered or self-powered. When

configuration is complete, the latched value will not change until the next reset assertion.

To enable dynamic local power switching, the DYNAMIC_POWER register at location

0x4134 must be programmed with 0x41. If dynamic power switching is not required, the

DYNAMIC_POWER register should be left at the default value of 0xC1. Programming may

Port 3 Power

Output

PRTPWR3

Enables power to a downstream USB device

attached to Port 3.

0 = Power disabled on downstream Port 3

1 = Power enabled on downstream Port 3

Port 3 Control

PRTCTL3

OD8/IS

(PU)

When configured as PRTCTL3, this pin functions

as both the Port 3 power enable output

(PRTPWR3) and the Port 3 over-current sense

input (OCS3_N). Refer to the PRTPWR3 and

OCS3_N descriptions for additional information.

Port 3 Battery

Charging

Configuration

Strap

BC_EN3

This strap is used to indicate support of the

battery charging protocol on Port 3. Enabling

battery charging support allows a device on the

port to draw currents per the USB battery

charging specification.

0 = Battery charging is not supported on Port 3

1 = Battery charging is supported on Port 3

See Note 3.4 for more information on

configuration straps.

No Connect

These pins must be left floating for normal device

operation.

POWER

+3.3V Analog

Power Supply

VDDA33

+3.3V analog power supply. Refer to Chapter 4,

"Power Connections," on page 21 for power

connection information.

+3.3V Power

Supply

VDD33

+3.3V power supply. These pins must be

connected to VDDA33. Refer to Chapter 4,

"Power Connections," on page 21 for power

connection information.

+1.2V Core

Power Supply

VDDCR12

+1.2V core power supply. A 1.0

μF (<1

Ω ESR)

capacitor to ground is required for regulator

stability. The capacitor should be placed as close

as possible to the device. Refer to Chapter 4,

"Power Connections," on page 21 for power

connection information.

Exposed

Pad on

package

bottom

(Figure 3.1)

Ground

VSS

Common ground. This exposed pad must be

connected to the ground plane with a via array.

Table 3.1 Pin Descriptions (continued)

NUM PINS

NAME

SYMBOL

BUFFER

TYPE

DESCRIPTION

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