W25Q80BWSVIP datasheet(73/74 Pages) WINBOND

73 / 74 page

W25Q80BW

Publication Release Date: July 30, 2013

- 73 -

Revision J

10.1 Valid Part Numbers and Top Side Marking

The following table provides the valid part numbers for the W25Q80BW SpiFlash Memory. Please contact

Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-

digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages

use an abbreviated 10-digit number.

PACKAGE TYPE

DENSITY

PRODUCT NUMBER

TOP SIDE MARKING

SOIC-8 150mil

8M-bit

W25Q80BWSNIG

W25Q80BWSNIP

W25Q80BWSNIL

25Q80BWNIG

25Q80BWNIP

25Q80BWNIL

(2)

VSOP-8 150mil

8M-bit

W25Q80BWSVIG

W25Q80BWSVIP

25Q80BWVIG

25Q80BWVIP

SOIC-8 208mil

8M-bit

W25Q80BWSSIG

W25Q80BWSSIP

25Q80BWSIG

25Q80BWSIP

(2)

VSOP-8 208mil

8M-bit

W25Q80BWSTIG

W25Q80BWSTIP

25Q80BWTIG

25Q80BWTIP

(1)

WSON-8 6x5mm

8M-bit

W25Q80BWZPIG

W25Q80BWZPIP

25Q80BWIG

25Q80BWIP

(3)

WLBGA-8

8M-bit

W25Q80BWBYIG

W25Q80BWBYIC

3Axx

Notes:

For WSON packages, the package type ZP is not used in the top side marking.

These package types are special order only, please contact Winbond for more information.

WLBGA package type BY has special top marking due to size limitation.

3 = 8Mb; A = W25Q series, 1.8V; xx = date code (year, work week).

W25Q80BWBYIC has backside coating.

W25Q80BWSVIP Datenblatt(PDF) 73 Page - Winbond

W25Q80BWSVIP Datenblatt(HTML) 73 Page - Winbond

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74

Datenblatt Download

Link URL