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STTH30W02C Datenblatt(PDF) 6 Page - STMicroelectronics |
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STTH30W02C Datenblatt(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() Package information STTH30W02C 6/8 Doc ID 023273 Rev 1 2 Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.55 N·m (1.0 N·m maximum) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-247 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D(1) 1. Dimension D plus gate protrusion does not exceed 20.5 mm 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e 5.30 5.45 5.60 0.209 0.215 0.220 L 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 L2 18.50 typ. 0.728 typ. P(2) 2. Resin thickness around the mounting hole is not less than 0.9 mm 3.55 3.65 0.139 0.143 R 4.50 5.50 0.177 0.217 S 5.30 5.50 5.70 0.209 0.216 0.224 E L2 S D c A1 BACK VIEW Heat-sink plane L1 L b1 b2 b A e 1 1 2 2 3 3 ÆR ÆP |
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