CC1020-RTR1 datasheet(86/95 Pages) TI1

86 / 95 page

CC1020

SWRS046H – NOVEMBER 2006 – REVISED MARCH 2015

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6.2.4

Crystal

An external crystal with two loading capacitors (C4 and C5) is used for the crystal oscillator. See

Section 5.16 for details.

6.2.5

Additional Filtering

Additional external components (for example, RF, LC, or SAW filter) may be used in order to improve the

performance in specific applications. See Section 5.11 for further information.

6.2.6

Power Supply Decoupling and Filtering

Power supply decoupling and filtering must be used (not shown in the application circuit). The placement

and size of the decoupling capacitors and the power supply filtering are very important to achieve the

optimum performance for narrowband applications. TI provides a reference design that should be followed

very closely.

6.3

PCB Layout Recommendations

The top layer should be used for signal routing, and the open areas should be filled with metallization

connected to ground using several vias.

The area under the chip is used for grounding and must be connected to the bottom ground plane with

several vias. In the TI reference designs we have placed 9 vias inside the exposed die attached pad.

These vias should be “tented” (covered with solder mask) on the component side of the PCB to avoid

migration of solder through the vias during the solder reflow process.

Do not place a via underneath CC1020 at “pin #1 corner” as this pin is internally connected to the exposed

die attached pad, which is the main ground connection for the chip.

Each decoupling capacitor should be placed as close as possible to the supply pin it is supposed to

decouple. Each decoupling capacitor should be connected to the power line (or power plane) by separate

vias. The best routing is from the power line (or power plane) to the decoupling capacitor and then to the

CC1020 supply pin. Supply power filtering is very important, especially for pins 23, 22, 20 and 18.

Each decoupling capacitor ground pad should be connected to the ground plane using a separate via.

Direct connections between neighboring power pins will increase noise coupling and should be avoided

unless absolutely necessary.

The external components should ideally be as small as possible and surface mount devices are highly

recommended.

Precaution should be used when placing the microcontroller in order to avoid noise interfering with the RF

circuitry.

A CC1020/1070DK Development Kit with a fully assembled CC1020EMX Evaluation Module is available.

It is strongly advised that this reference layout is followed very closely in order to get the best

performance. The layout Gerber files are available from the CC1020EMX product folder.

Applications, Implementation, and Layout

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CC1020-RTR1 Datenblatt(PDF) 86 Page - Texas Instruments

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