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SC1200 Datenblatt(PDF) 14 Page - Texas Instruments |
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SC1200 Datenblatt(HTML) 14 Page - Texas Instruments |
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14 / 60 page ![]() MSC1200 14 SBAS289E www.ti.com The MSC1200Yx allows the user to uniquely configure the Flash memory map to meet the needs of their application. The Flash is programmable down to 2.7V using serial pro- gramming. Flash endurance is typically 1M Erase/Write cycles. The part has separate analog and digital supplies, which can be independently powered from 2.7V to +5.25V. At +3V operation, the power dissipation for the part is typically less than 4mW. The MSC1200Yx is packaged in a TQFP-48 package. The MSC1200Yx is designed for high-resolution measurement applications in smart transmitters, industrial process control, weigh scales, chromatography, and portable instrumentation. ENHANCED 8051 CORE All instructions in the MSC1200 family perform exactly the same functions as they would in a standard 8051. The effect on bits, flags, and registers is the same. However, the timing is different. The MSC1200 family utilizes an efficient 8051 core which results in an improved instruction execution speed of between 1.5 and 3 times faster than the original core for the same external clock speed (4 clock cycles per instruction versus 12 clock cycles per instruction, as shown in Figure 2). This translates into an effective throughput improvement of more than 2.5 times, using the same code and same external clock speed. Therefore, a device frequency of 33MHz for the MSC1200Yx actually performs at an equivalent execution speed of 82.5MHz compared to the DESCRIPTION The MSC1200Yx is a completely integrated family of mixed- signal devices incorporating a high-resolution delta-sigma ADC, 8-bit IDAC, 8-channel multiplexer, burnout detect cur- rent sources, selectable buffered input, offset DAC, program- mable gain amplifier (PGA), temperature sensor, voltage reference, 8-bit microcontroller, Flash Program Memory, Flash Data Memory, and Data SRAM, as shown in Figure 1. On-chip peripherals include an additional 32-bit accumulator, basic SPI, basic I2C, USART, multiple digital input/output ports, watchdog timer, low-voltage detect, on-chip power-on reset, brownout reset, timer/counters, system clock divider, PLL, on-chip oscillator, and external interrupts. The device accepts low-level differential or single-ended signals directly from a transducer. The ADC provides 24 bits of resolution and 24 bits of no-missing-code performance using a Sinc3 filter with a programmable sample rate. The ADC also has a selectable filter that allows for high-resolu- tion single-cycle conversion. The microcontroller core is 8051 instruction set compatible. The microcontroller core is an optimized 8051 core that executes up to three times faster than the standard 8051 core, given the same clock source. This makes it possible to run the device at a lower external clock frequency and achieve the same perfor- mance at lower power than the standard 8051 core. ACC MUX AV DD V REF Modulator 4K or 8K FLASH 128 Bytes SRAM Digital Filter 8051 SFR ALVD DBOR System Clock Divider POR PORT1 WDT Alternate Functions Timers/ Counters PLL PORT3 DIN DOUT SS EXT (4) PROG USART EXT (2) T0 T1 SCK/SCL/CLKS On-Chip Oscillator 8-Bit Offset DAC 8-Bit IDAC Burnout Detect AIN0 AIN1 AIN2 AIN3 AIN4 AIN5 AIN6 AIN7 AINCOM IDAC AGND REFOUT/REFIN+ REFIN– DV DD DGND XIN XOUT Temperature Sensor Burnout Detect RST CAP 220pF Ceramic AGND AV DD BUFFER PGA NOTE (1) REF IN − must be tied to AGND when using internal V REF. (1) FIGURE 1. Block Diagram. FIGURE 2. Instruction Cycle Timing. CLK instr_cycle cpu_cycle C1 C2 C3 C4 C1 C2 C3 C4 C1 n + 1 n + 2 |
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