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CGHV59070 Datenblatt(PDF) 2 Page - Cree, Inc |
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CGHV59070 Datenblatt(HTML) 2 Page - Cree, Inc |
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2 / 10 page ![]() 2 CGHV59070 Rev 1.0 Cree, Inc. 4600 Silicon Drive Durham, North Carolina, USA 27703 USA Tel: +1.919.313.5300 Fax: +1.919.869.2733 www.cree.com/rf Copyright © 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Absolute Maximum Ratings (not simultaneous) at 25˚C Case Temperature Parameter Symbol Rating Units Conditions Drain-Source Voltage V DSS 150 Volts 25˚C Gate-to-Source Voltage V GS -10, +2 Volts 25˚C Storage Temperature T STG -65, +150 ˚C Operating Junction Temperature T J 225 ˚C Maximum Forward Gate Current I GMAX 10.4 mA 25˚C Maximum Drain Current1 I DMAX 6.3 A 25˚C Soldering Temperature2 T S 245 ˚C Screw Torque τ 40 in-oz Thermal Resistance, Junction to Case3 R θ JC 2.99 ˚C/W 85˚C, CW @ P DISS = 57 W Thermal Resistance, Junction to Case3 R θ JC 0.85 ˚C/W 85˚C, 100 μsec, 10% Duty Cycle @ P DISS = 70 W Case Operating Temperature2 T C -40, +150 ˚C Note: 1 Current limit for long term, reliable operation 2 Refer to the Application Note on soldering at www.cree.com/RF/Document-Library 3 Simulated for the CGHV59070F at P DISS = 57.6 CW or PDISS = 70 W Pulsed 4 See also, the Power Dissipation De-rating Curve on Page 8. Electrical Characteristics (T C = 25˚C) Characteristics Symbol Min. Typ. Max. Units Conditions DC Characteristics1 Gate Threshold Voltage V GS(th) -3.8 -2.8 -2.3 V DC V DS = 10 V, ID = 10.4 mA Saturated Drain Current2 I DS 7.8 10.4 – A V DS = 6.0 V, VGS = 2.0 V Drain-Source Breakdown Voltage V BR 150 – – V DC V GS = -8 V, ID = 10.4 mA RF Characteristics3 (T C = 25˚C, F0 = 2.5 GHz unless otherwise noted) Output Power P OUT1 – 100 – W V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.2 GHz Output Power P OUT1 – 95 – W V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.55 GHz Output Power P OUT1 – 76 – W V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.9 GHz Drain Efficiency EFF 1 – 57 – % V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.2 GHz Drain Efficiency EFF 2 – 54 – % V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.55 GHz Drain Efficiency EFF 3 – 48 – % V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.9 GHz Power Gain PG 1 – 14.5 – dB V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.2 GHz Power Gain PG 2 – 14.3 – dB V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.55 GHz Power Gain PG 3 – 13.3 – dB V DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.9 GHz Output Mismatch Stress VSWR – – 5 : 1 Y No damage at all phase angles, V DD = 50 V, IDQ = 0.15A, PIN = 35.5 dBm Pulsed Dynamic Characteristics Input Capacitance C GS – 36 – pF V DS = 50 V, Vgs = -8 V, f = 1 MHz Output Capacitance C DS – 109 – pF V DS = 50 V, Vgs = -8 V, f = 1 MHz Feedback Capacitance C GD – 0.26 – pF V DS = 50 V, Vgs = -8 V, f = 1 MHz Notes: 1 Measured on wafer prior to packaging. 2 Scaled from PCM data. 3 Measured in CGHV59070F-AMP 4 Drain Efficiency = P OUT / PDC |
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