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CGHV59070 Datenblatt(PDF) 2 Page - Cree, Inc

Teilenummer CGHV59070
Bauteilbeschribung  70 W, 4.4-5.9 GHz, 50 V, RF Power GaN HEMT
PDF  10 Pages
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Hersteller  CREE [Cree, Inc]
Direct Link  http://www.cree.com/
Logo CREE - Cree, Inc

CGHV59070 Datenblatt(HTML) 2 Page - Cree, Inc

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CGHV59070 Rev 1.0
Cree, Inc.
4600 Silicon Drive
Durham, North Carolina, USA 27703
USA Tel: +1.919.313.5300
Fax: +1.919.869.2733
www.cree.com/rf
Copyright © 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
Absolute Maximum Ratings (not simultaneous) at 25˚C Case Temperature
Parameter
Symbol
Rating
Units
Conditions
Drain-Source Voltage
V
DSS
150
Volts
25˚C
Gate-to-Source Voltage
V
GS
-10, +2
Volts
25˚C
Storage Temperature
T
STG
-65, +150
˚C
Operating Junction Temperature
T
J
225
˚C
Maximum Forward Gate Current
I
GMAX
10.4
mA
25˚C
Maximum Drain Current1
I
DMAX
6.3
A
25˚C
Soldering Temperature2
T
S
245
˚C
Screw Torque
τ
40
in-oz
Thermal Resistance, Junction to Case3
R
θ
JC
2.99
˚C/W
85˚C, CW @ P
DISS = 57 W
Thermal Resistance, Junction to Case3
R
θ
JC
0.85
˚C/W
85˚C, 100 μsec, 10% Duty Cycle @ P
DISS = 70 W
Case Operating Temperature2
T
C
-40, +150
˚C
Note:
1
Current limit for long term, reliable operation
2
Refer to the Application Note on soldering at www.cree.com/RF/Document-Library
3
Simulated for the CGHV59070F at P
DISS = 57.6 CW or PDISS = 70 W Pulsed
4
See also, the Power Dissipation De-rating Curve on Page 8.
Electrical Characteristics (T
C = 25˚C)
Characteristics
Symbol
Min.
Typ.
Max.
Units
Conditions
DC Characteristics1
Gate Threshold Voltage
V
GS(th)
-3.8
-2.8
-2.3
V
DC
V
DS = 10 V, ID = 10.4 mA
Saturated Drain Current2
I
DS
7.8
10.4
A
V
DS = 6.0 V, VGS = 2.0 V
Drain-Source Breakdown
Voltage
V
BR
150
V
DC
V
GS = -8 V, ID = 10.4 mA
RF Characteristics3 (T
C = 25˚C, F0 = 2.5 GHz unless otherwise noted)
Output Power
P
OUT1
100
W
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.2 GHz
Output Power
P
OUT1
95
W
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.55 GHz
Output Power
P
OUT1
76
W
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.9 GHz
Drain Efficiency
EFF
1
57
%
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.2 GHz
Drain Efficiency
EFF
2
54
%
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.55 GHz
Drain Efficiency
EFF
3
48
%
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.9 GHz
Power Gain
PG
1
14.5
dB
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.2 GHz
Power Gain
PG
2
14.3
dB
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.55 GHz
Power Gain
PG
3
13.3
dB
V
DD = 50 V, IDQ = 0.15 A, PIN = 35.5 dBm, Freq = 5.9 GHz
Output Mismatch Stress
VSWR
5 : 1
Y
No damage at all phase angles, V
DD = 50 V, IDQ = 0.15A, PIN = 35.5 dBm Pulsed
Dynamic Characteristics
Input Capacitance
C
GS
36
pF
V
DS = 50 V, Vgs = -8 V, f = 1 MHz
Output Capacitance
C
DS
109
pF
V
DS = 50 V, Vgs = -8 V, f = 1 MHz
Feedback Capacitance
C
GD
0.26
pF
V
DS = 50 V, Vgs = -8 V, f = 1 MHz
Notes:
1
Measured on wafer prior to packaging.
2
Scaled from PCM data.
3
Measured in CGHV59070F-AMP
4
Drain Efficiency = P
OUT / PDC



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