USB84604 datasheet(53/61 Pages) MICROCHIP

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 2014-2016 Microchip Technology Inc.

DS60001295C-page 53

USB84604

FIGURE 10-1:

USB84604 48-PIN QFN PACKAGE DRAWING

Microchip Technology Drawing C04-363A Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

(A3)

0.50 BSC

0.20 REF

5.00

0.30

0.20

0.80

0.00

0.25

0.40

5.10

0.85

0.01

7.00 BSC

MILLIMETERS

MIN

NOM

5.20

0.50

0.30

0.90

0.05

MAX

0°

12°

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is punch singulated

Dimensioning and tolerancing per ASME Y14.5M

Mold Draft Angle

0.60

0.65

0.70

6.75 BSC

Mold Cap Height

Molded Top Width

Molded Top Length

Terminal-to-Exposed-Pad

0.20

7.00 BSC

6.75 BSC

DETAIL A

DETAIL B

Terminal Dimple Width

0.10

0.15

0.20

Terminal Dimple Length (side)

Terminal Dimple Length (bottom)

0.05

0.15

0.25

0.05

0.10

0.15

Corner Chamfer

0.24

0.42

0.60

5.00

5.10

5.20

TERMINAL DIMPLES

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

48-Lead Plastic Quad Flat, No Lead Package (5E) - 7x7 mm Body [QFN]

With 5.1x5.1 mm Exposed Pad; Punch Singulated, 0.40 mm Dimpled Terminals

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