PE42510AMLI-Z datasheet(5/7 Pages) PSEMI

5 / 7 page

Product Specification

PE42510A

Page 5 of 7

Document No. 70-0266-03 │ www.psemi.com

Figure 12. Power Dissipation

Figure 13. Maximum Junction Temperature

Thermal Data

Though the insertion loss for this part is very low,

when handling high power RF signals, the part can get

quite hot.

Figure 12 shows the estimated power dissipation for a

given incident RF power level. Multiple curves are

presented to show the effect of poor VSWR conditions.

VSWR conditions that present short circuit loads to the

part can cause significantly more power dissipation

than with proper matching.

Figure 13 shows the estimated maximum junction

temperature of the part for similar conditions.

Note that both of these charts assume that the case

(GND slug) temperature is held at 85°C. Special

consideration needs to be made in the design of the

PCB to properly dissipate the heat away from the part

and maintain the 85°C maximum case temperature. It

is recommended to use best design practices for high

power QFN packages: multi-layer PCBs with thermal

vias in a thermal pad soldered to the slug of the

package. Special care also needs to be made to

alleviate solder voiding under the part.

Table 6. Theta JC

Parameter

Min

Typ

Max

Units

Theta JC (+85°C)

24.0

C/W

100

105

110

115

120

125

130

135

140

145

30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46

RF Power (dBm)

1:1 VS WR (50 Ohm Load)

2:1 VS WR (25 Ohm Load)

8:1 VS WR (6. 25 Ohm Load)

20:1 VSWR (2.5 Ohm Load)

INF:1 V SWR (0 Ohm Load)

Reliability Limit

GN D

RF 1

GN D

RF 2

GN D

E x pos e d

G r ound

P addle

Note: Case temperature = 85°C

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