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WM8152 Datenblatt(PDF) 5 Page - Cirrus Logic

Teilenummer WM8152
Bauteilbeschribung  Single Channel 16-bit CIS/CCD AFE with 4-bit Wide Output
PDF  28 Pages
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Hersteller  CIRRUS [Cirrus Logic]
Direct Link  http://www.cirrus.com
Logo CIRRUS - Cirrus Logic

WM8152 Datenblatt(HTML) 5 Page - Cirrus Logic

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Production Data
WM8152
w
PD, Rev 4.3, August 2008
5
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30
°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30
°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30
°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
CONDITION
MIN
MAX
Analogue supply voltage: AVDD
GND - 0.3V
GND + 7V
Digital core voltage: DVDD1
GND - 0.3V
GND + 7V
Digital IO supply voltage: DVDD2
GND - 0.3V
GND + 7V
Digital ground: DGND
GND - 0.3V
GND + 0.3V
Analogue grounds: AGND1
− 2
GND - 0.3V
GND + 0.3V
Digital inputs, digital outputs and digital I/O pins
GND - 0.3V
DVDD2 + 0.3V
Analogue input (VINP)
GND - 0.3V
AVDD + 0.3V
Other pins
GND - 0.3V
AVDD + 0.3V
Operating temperature range: TA
0°C
+70°C
Storage temperature after soldering
-65°C
+150°C
Package body temperature (soldering, 10 seconds)
+260°C
Package body temperature (soldering, 2 minutes)
+183
°C
Notes:
1.
GND denotes the voltage of any ground pin.
2.
AGND1, AGND2 and DGND pins are intended to be operated at the same potential. Differential voltages
between these pins will degrade performance.
RECOMMENDED OPERATING CONDITIONS
CONDITION
SYMBOL
MIN
TYP
MAX
UNITS
Operating temperature range
TA
0
70
°C
Analogue supply voltage
AVDD
4.75
5.0
5.25
V
Digital core supply voltage
DVDD1
4.75
5.0
5.25
V
5V I/O
DVDD2
4.75
5.0
5.25
V
Digital I/O supply voltage
3.3V I/O
DVDD2
2.97
3.3
3.63
V
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Performance
Thermal resistance – junction to
case
RθJC
32.2
°C/W
Thermal resistance – junction to
ambient
RθJA
Tambient = 25°C
81.1
°C/W
Notes:
1.
Figures given are for package mounted on 4-layer FR4 according to JESD51-5 and JESD51-7.



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