Data Sheet

ADRF5062

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 5 of 11

For recommended operating conditions, see Table 1.

Table 3. Absolute Maximum Ratings

Parameter1, 2

Rating

Supply Voltage

Positive

−0.3V to +3.6 V

Negative

−3.6 V to +0.3 V

Digital Control Inputs3

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power (VDD= 3.3 V, VSS = −3.3 V,

f4 = 100 MHz to 13 GHz, TCASE = 85°C5 )

Through Path

33.5 dBm

Terminated Path

30.5 dBm

Hot Switching (RFC)

27.5 dBm

RF Input Power4 (VDD= 3.3 V, VSS= 0 V,

f = 100 MHz to 13 GHz, TCASE = 85°C)

Through Path

22.5 dBm

Terminated Path

22.5 dBm

Hot Switching (RFC)

22.5 dBm

RF Input Power, Unbiased (VDD and VSS = 0 V) 30 dBm

Temperature

Junction, TJ

135°C

Storage Range

−65°C to +150°C

Reflow

260°C

1 RF input power specifications are defined over 100 Ω differential pairs.

2 RFC refers to the RFCP and RFCN differential pair.

3 Overvoltages at the digital control inputs are clamped by internal diodes.

Current must be limited to the maximum rating given.

4 For power derating over frequency, see Figure 2.

5 For 105°C operation, the power handling degrades from the TCASE = 85°C

specification by 3 dB.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to package bottom)

thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC1

Unit

CC-20-15

Through Path

100

°C/W

Table 4. Thermal Resistance (Continued)

Package Type

θJC1

Unit

Terminated Path

50

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVE

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD

sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADRF5062

Table 5. ADRF5062, 20-Terminal LGA

ESD Model1

Withstand Threshold (V)

Class

HBM

RF1x, RF2x, and RFCx Pins

500

1A

Supply and Control Pins

1500

1C

CDM

500

C2A

1 RF1x refers to the RF1P and RF1N, RF2x refers to the RF2P and RF2N pins,

and RFCx refers to the RFCP and RFCN pins.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.