Datenblatt-Suchmaschine für elektronische Bauteile
  German  ▼
ALLDATASHEETDE.COM

X  

Preview PDF HTML

PCF8883US/7EA/1 Datenblatt(PDF) 25 Page - NXP Semiconductors

Teilenummer PCF8883US/7EA/1
Bauteilbeschribung  Capacitive touch/proximity switch with auto-calibration, large voltage operating range, and very low power consumption
PDF  35 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8883US/7EA/1 Datenblatt(HTML) 25 Page - NXP Semiconductors

Back Button PCF8883US/7EA/1 Datasheet HTML 21Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 22Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 23Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 24Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 25Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 26Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 27Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 28Page - NXP Semiconductors PCF8883US/7EA/1 Datasheet HTML 29Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 25 / 35 page
background image
PCF8883
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 4.1 — 14 September 2016
25 of 35
NXP Semiconductors
PCF8883
Capacitive touch/proximity switch with auto-calibration
19.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 13 and 14
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
Table 13.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
 350
< 2.5
235
220
 2.5
220
220
Table 14.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35


Datenblatt Download

Go To PDF Page


Link URL



War ALLDATASHEET hilfreich?  [ DONATE ] 

Über Alldatasheet   |   Werbung   |   Kontakt   |   Privatsphäre und Datenschutz   |   Link zum Datenblatt    |   Linktausch   |   Hersteller
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com