4

TCA9543A

SCPS206B – MARCH 2014 – REVISED NOVEMBER 2019

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Copyright © 2014–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

7

V

VI

Input voltage range(2)

–0.5

7

V

II

Input current

±20

mA

IO

Output current

±25

mA

Continuous current through VCC

±100

mA

Continuous current through GND

±100

mA

Ptot

Total power dissipation

400

mW

TA

Operating free-air temperature range

–40

85

°C

Tstg

Storage temperature range

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1500

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

6.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

VCC

Supply voltage

1.65

5.5

V

VIH

High-level input voltage

SCL, SDA

0.7 × VCC

6

V

A1, A0, INT1, INT0, RESET

0.7 × VCC

VCC + 0.5

VIL

Low-level input voltage

SCL, SDA

–0.5

0.3 × VCC

V

A1, A0, INT1, INT0, RESET

–0.5

0.3 × VCC

TA

Operating free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TCA9543A

UNIT

PW

D

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

130.9

102.8

°C/W

RθJCtop

Junction-to-case (top) thermal resistance

59.2

63.9

RθJB

Junction-to-board thermal resistance

72.7

57.1

ψJT

Junction-to-top characterization parameter

10.5

26.7

ψJB

Junction-to-board characterization parameter

72.1

56.8