9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Digital Isolator Design Guide, application note

• Texas Instruments, Isolation Glossary, application note

• Texas Instruments, How to use isolation to improve ESD, EFT, and Surge immunity in industrial systems,

analog design journal

• Texas Instruments, SN6501 Transformer Driver for Isolated Power Supplies, data sheet

• Texas Instruments, SN65HVD23x 3.3-V CAN Bus Transceivers, data sheet

• Texas Instruments, TMS320F28035 Piccolo™ Microcontrollers, data sheet

• Texas Instruments, TPS76333 Low-Power 150-mA Low-Dropout Linear Regulators, data sheet

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

Piccolo™ is a trademark of Texas Instruments.

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (March 2023) to Revision E (December 2024)

Page

• Updated the number formatting for tables, figures, and cross-references throughout the document................ 1

• Updated maximum power dissipation in the power ratings section....................................................................7

• Updated distance through isolation, while maintaining other insulation specifications.......................................8

• Updated maximum total current consumption values throughout the supply current characteristics sections. 11

• Updated maximum propagation delay specifications throughout the switching characteristics sections......... 14

• Updated TDDB plot and the projected lifetime................................................................................................. 23

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