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BD9DA00MF

Datasheet

TSZ02201-0J2J0AB01940-1-2

© 2025 ROHM Co., Ltd. All rights reserved.

18.Mar.2025 Rev.001

www.rohm.com

TSZ22111 • 15 • 001

Absolute Maximum Ratings

Parameter

Symbol

Rating

Unit

Input Voltage

VIN

-0.3 to +18.0

V

SW Voltage (DC)

VSW

-0.3 to VIN + 0.3

V

SW Voltage (AC, 3 ns or less)

VSWAC

-5.0 to +20.0

V

Voltage from GND to BST

VBST

-0.3 to +22.5

V

Voltage from SW to BST

ΔVBST-SW

-0.3 to +4.5

V

FB Voltage

VFB

-0.3 to +4.5

V

VCC Voltage

VCC

-0.3 to +4.5

V

MODE Voltage

VMODE

-0.3 to +4.5

V

ILIM Voltage

VILIM

-0.3 to +4.5

V

PGD Voltage

VPGD

-0.3 to +7.0

V

EN Voltage

VEN

-0.3 to +7.0

V

SS/REF Voltage

VSSREF

-0.3 to +4.5

V

RGND Voltage

VRGND

-0.3 to +0.3

V

Maximum Peak Inductor Current

IL_PEAKMAX

18

A

Maximum Junction Temperature(Note 1)

Tjmax

125

°C

Storage Temperature Range

Tstg

-55 to +125

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) The lifetime and reliability of the device is reduced if the device operates continually at the maximum junction temperature.

Thermal Resistance(Note 2)

Parameter

Symbol

Thermal Resistance (Typ)

Unit

2s2p(Note 4)

EVK(Note 5)

UFN014V3040

Junction to Ambient

θJA

52.4

28.7

°C/W

Junction to Top Characterization Parameter(Note 3)

ΨJT

4.0

4.0

°C/W

(Note 2) Based on JESD51-2A (Still-Air).

(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 4) Using a PCB board based on JESD51-7.

(Note 5) Evaluation Kit. Measured on FR-4 board 80.0 mm x 80.0 mm x 1.6 mm, Copper Thickness: All Layers 70μm.

Layer Number of

Measurement Board

Material

Board Size

4 Layers

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

Top

2 Internal Layers

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

74.2 mm x 74.2 mm

35 μm

74.2 mm x 74.2 mm

70 μm