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E39-R Datenblatt(PDF) 57 Page - Omron Electronics LLC

Teilenummer E39-R
Bauteilbeschribung  Start with Smart! Easily select the most reliable Fiber Unit for your detection conditions.
PDF  100 Pages
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Hersteller  OMRON [Omron Electronics LLC]
Direct Link  http://www.omron.com/index3.html
Logo OMRON - Omron Electronics LLC

E39-R Datenblatt(HTML) 57 Page - Omron Electronics LLC

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Special Applications
Special Applications
56
56
Threaded
Cylindrical
Flat
Sleeved
Small Spot
High Power
Retro-
reflective
Limited-
reflective
Narrow
view
BGS
Chemical-
resistant,
Oil-resistant
Bending
Heat-
resistant
Area
Detection
Liquid-level
Vacuum
FPD,
Semi,
Solar
Installation
Information
57
57
Installation
Information
Threaded
Cylindrical
Flat
Sleeved
Small Spot
High Power
Retro-
reflective
Limited-
reflective
Narrow
view
BGS
Chemical-
resistant,
Oil-resistant
Bending
Heat-
resistant
Area
Detection
Liquid-level
Vacuum
FPD,
Semi,
Solar
FPD, Semiconductors, and Solar Cells
FPD, Semiconductors, and Solar Cells Limited-reflective → 54 page Through-beam → This page
E32-T24SR 2M (Free Cutting)
E32-A03-1 2M (Free Cutting)
57-D
57-B
E32-T24S 2M (Free Cutting)
E32-A04 2M (Free Cutting)
57-E
E32-A03 2M (Free Cutting)
57-A
57-C
3.2
10
E39-L83 Mounting Bracket
(SUS) (provided)
2.2 dia.
1.8
20.5
2
1.5
Sensing surface: 1.7 dia.
2,000
11
3.4
3.5 dia.
0.4
17.6
3.2
(SUS303)
Note: Use the engraved surface and its opposing surface as
installation (reference) surfaces.
Note: Use the engraved surface and its opposing surface as
installation (reference) surfaces.
2.95
dia.
E39-L83 Mounting Bracket
(SUS) (provided)
2
6
Sensing surface: 1.7 dia.
E39-F9:
Provided
(SUS303)
Engraved mark:
1 dia.
2,000
0.4
1.8
3.2
10
11
17.6
3.2
3.4
4.3
3.5
dia.
20.5
Note1: Use the engraved surface and its opposing surface as
installation (reference) surfaces.
2. Set of two symmetrical parts.
13
12.5
3
6.5
2,000
Mounting holes
Two, 3.4 dia
Engraved mark:
1 dia.
1 dia.
Sensing surface:
1.7 dia.
(SUS303)
2.95 dia.
4.5
3.5
10
3
E39-F9:
Provided
24.5
2
4
2,000
20.5
2
2
Sensing surface: 1.2 dia.
2 dia.
E39-F9: Provided
(SUS303)
1 dia.
Engraved mark: 1 dia.
3.2
10
2.2 dia.
1.8
20.5
2
1.5
Sensing surface: 1.7 dia.
2,000
11
3.4
3.5 dia.
0.4
17.6
3.2
(SUS303)
E39-L83 Mounting Bracket
(SUS) (provided)
1,920
670
2,610
4,000 *
2,190
4,000 *
4,000 *
1,800
3.5 dia.
20.5
20.5
24.5
10
20.5
Thickness: 3 mm
Thickness: 3 mm
Thickness: 2 mm
E32-T24SR 2M
Application Ambient
temperature
Aperture
angle
70°C
4°
3.4°
1.5°
Wafer
Mapping
R10
R10
Flexible,
R1
Flexible,
R1
2 dia.
(0.1 dia./
0.03 dia.)
2 dia.
(0.1 dia./
0.03 dia.)
1.2 dia.
(0.1 dia./
0.03 dia.)
E32-T24S 2M
57-D
E32-A03 2M
57-A
E32-A03-1 2M
57-B
E32-A04 2M
57-C
57-E
Appearance (mm)
Bending
radius
of cable
Sensing distance (mm)
Optical axis
diameter
(minimum
sensing
object)
Models
57 Page
Dimensions
No.
3,300
580
ST :
SHS:
3,900
700
ST :
SHS:
2,670
500
ST :
SHS:
1,020
200
ST :
SHS:
1,280
450
1,740
4,000 *
E3X-HD
1,460
4,000 *
2,200
580
ST :
SHS:
2,600
700
ST :
SHS:
3,220
1,200
1,780
500
ST :
SHS:
680
200
ST :
SHS:
IP50
IP50
IP50
IP50
* The optical fiber is 2 m long on each side, so the sensing distance is 4,000 mm.
E3NX-FA
The following mode names and response times apply to the modes given in the Sensing distance column.
[E3X-HD] GIGA: Giga-power mode (16 ms), HS: High-speed mode (250 μs), ST: Standard mode (1 ms), and SHS: Super-high-speed mode (NPN output: 50 μs, PNP output: 55 μs)
[E3NX-FA] GIGA: Giga-power mode (16 ms), HS: High-speed mode (250 μs), ST: Standard mode (1 ms), and SHS: Super-high-speed mode (30 μs)
The values for the minimum sensing object are reference values that indicate values obtained in standard mode with the sensing distance and sensitivity set to the optimum values.
The first value is for the E3X-HD and the second value is for the E3NX-FA.
Note 1.
2.
Other modes
HS
GIGA
Other modes
HS
GIGA
Wafer Mapping
Specifications
Dimensions
•
Wafer Mapping
Through-beam Fiber Units
Through-beam Fiber Units (Set of 2)
Installation Information → 58, 60 Page
2 wafers
12-inch silicon wafer
150 mm
10 mm
(E32-A04, High-speed mode)
E32-A04+E3NX-FA21
Mapping Characteristics
Digital value
−10
0 2500 5000 7500 9999
−5
0
5
10
Thin-profile design enables easy mounting on robot arms.
Reliably wafer detection, even when stacked closely together.
Easy to adjust optical axis.
(Typical alignment error between mechanical and optical axes is only ±0.1°.)
Detection
Detection



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