| Datenblatt-Suchmaschine für elektronische Bauteile |
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H30R90 Datenblatt(PDF) 2 Page - Infineon Technologies AG |
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H30R90 Datenblatt(HTML) 2 Page - Infineon Technologies AG |
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2 / 12 page ![]() IHW30N90R Soft Switching Series q Power Semiconductors 2 Rev. 2.2 Nov 08 Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, junction – case R thJC 0.33 Diode thermal resistance, junction – case R thJC D 0.33 Thermal resistance, junction – ambient R thJA 40 K/W Electrical Characteristic, at Tj = 25 °C, unless otherwise specified Value Parameter Symbol Conditions min. Typ. max. Unit Static Characteristic Collector-emitter breakdown voltage V (BR)CES VGE =0V, IC=0.5mA 900 - - Collector-emitter saturation voltage V CE(sat) V GE = 15 V, IC =30A T j=25°C T j= 150 °C T j= 175 °C - - - 1.5 1.6 1.7 1.7 - - Diode forward voltage V F V GE =0V, IF=30A T j=25°C T j= 150 °C T j= 175 °C - - - 1.4 1.4 1.45 1.6 - - Gate-emitter threshold voltage V GE(th) I C =700 μA,VCE =VGE 5.1 5.8 6.4 V Zero gate voltage collector current I CES V CE =900V, V GE =0V T j=25°C T j= 150 °C - - - - 5 2500 μA Gate-emitter leakage current I GES V CE =0V,VGE =20V - - 600 nA |
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