IO13PDB0V0 datasheet(72/197 Pages) MICROSEMI

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SmartFusion DC and Switching Characteristics

2- 60

R e v i sio n 1 2

Timing Characteristics

Table 2-80 • A2F500 Global Resource

Worst Commercial-Case Conditions: TJ = 85°C, VCC = 1.425 V

Parameter

Description

–1

Std.

Units

Min.1

Max.2

Min.1

Max.2

tRCKL

Input Low Delay for Global Clock

1.54

1.73

1.84

2.08

tRCKH

Input High Delay for Global Clock

1.53

1.76

1.84

2.12

tRCKMPWH

Minimum Pulse Width High for Global Clock

0.85

1.00

tRCKMPWL

Minimum Pulse Width Low for Global Clock

0.85

1.00

tRCKSW

Maximum Skew for Global Clock

0.23

0.28

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage-supply levels, refer to Table 2-7 on page 2-9 for derating

values.

Table 2-81 • A2F200 Global Resource

Worst Commercial-Case Conditions: TJ = 85°C, VCC = 1.425 V

Parameter

Description

–1

Std.

Units

Min.1

Max.2

Min.1

Max.2

tRCKL

Input Low Delay for Global Clock

0.74

0.99

0.88

1.19

tRCKH

Input High Delay for Global Clock

0.76

1.05

0.91

1.26

tRCKMPWH

Minimum Pulse Width High for Global Clock

0.85

1.00

tRCKMPWL

Minimum Pulse Width Low for Global Clock

0.85

1.00

tRCKSW

Maximum Skew for Global Clock

0.29

0.35

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage-supply levels, refer to Table 2-7 on page 2-9 for derating

values.

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