30

µPD75P218

7.

RECOMMENDED SOLDERING CONDITIONS

The following conditions (See table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done

under different conditions.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(IEI-1207).

TYPE OF SURFACE MOUNT DEVICE

µPD75P218GF-3BR

Soldering Process

Wave Soldering

Infrared Ray Reflow

VPS

Partial Heating

Method

Soldering Conditions

Solder temperature: 260 ˚C or lower,

Flow time: 10 seconds or less,

7 days (10 hour pre-baking is required at 125 ˚C

afterwards)

Number of flow processes: 1

Peak temperature of package surface: 230 ˚C or lower

Reflow time: 30 seconds or less (210 ˚C or higher),

Number of reflow processes: 1

7 days (10 hour pre-baking is required at 125 ˚C

afterwards)

Peak temperature of package surface: 215 ˚C or lower

Reflow time: 40 seconds or less (200 ˚C or higher),

Number of reflow processes: 1

7 days (10 hour pre-baking is required at 125 ˚C

afterwards)

Pin temperature: 300 ˚C or lower,

Time: 3 seconds or less (Per side of the package)

Symbol

WS60-107-1

IR30-107-1

VP15-107-1

–

Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 ˚C and

relative humidity at 65 % or less.

Caution Do not apply more than one soldering method at any one time, except for "Partial heating method".

TYPE OF THROUGH HOLE DEVICE

µPD75P218CW

Soldering Conditions

Solder temperature: 260 ˚C or lower,

Flow time: 10 seconds or less

Pin temperature: 260 ˚C or lower,

Time: 10 seconds or less

Soldering Process

Wave Soldering

(only lead part)

Partial Heating

Method

Caution This wave soldering should be applied only to lead part, and do not jet molten solder on the surface

of package.