UPD75P218KB datasheet(9/36 Pages) NEC

9 / 36 page

µPD75P218

DIFFERENCES BETWEEN THE

µPD75P218 AND THE µPD75P216A, 75217, 75218

Item

ROM

RAM

FIP control-

ler/driver

Pull-down

resistors

Pin connec-

tion

Operating ambient tempera-

ture

Power supply voltage

Stack area

16K-byte mode/32K-byte

mode switching function

Package

Part number

segments

digits

P60 - P63

S0 - S8, T0 - T9

SD9, T10 - T15

P10

P30 - P33

VPRE

µPD75P216A

One-time PROM

16K

× 8

512

× 4

µPD75217

Mask ROM

24K

× 8

768

× 4

µPD75218 Note

Mask ROM

32K

× 8

µPD75P218

PROM

32K

× 8

1024

× 4

9 - 16 segments

9 - 16 digits

Not available

On-chip

Not available

(open drain)

INT0/VPP

(common use)

MD0 - MD3

(common use)

Not available (NC)

–10 to +70 ˚C

5 V

± 10 %

Bank 0

64-pin plastic

shrink DIP

Mask-option

INT0 (common use)

No common use

Available

–40 to +85 ˚C

64-pin plastic shrink DIP

64-pin plastic QFP

Not available

On-chip

Not available

(open drain)

INT0/VPP

(common use)

MD0 - MD3

(common use)

Not available (NC)

–40 to +70 ˚C

Available

64-pin plastic

shrink DIP

64-pin plastic QFP

64-pin ceramic

LCC with window

2.7 - 6.0 V

Bank 0 - 3

Bank 0 - 2

Not available

Note Under development

UPD75P218KB Datenblatt(PDF) 9 Page - NEC

UPD75P218KB Datenblatt(HTML) 9 Page - NEC

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