| Datenblatt-Suchmaschine für elektronische Bauteile |
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80960JD Datenblatt(PDF) 26 Page - Intel Corporation |
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80960JD Datenblatt(HTML) 26 Page - Intel Corporation |
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26 / 59 page ![]() 80960JD 20 PRODUCT PREVIEW Table 11. 132-Lead PQFP Package Thermal Characteristics Thermal Resistance — °C/Watt Parameter Airflow — ft./min (m/sec) 0 (0) 50 (0.25) 100 (0.50) 200 (1.01) 400 (2.03) 600 (3.04) 800 (4.06) 1000 (5.08) θ JC (Junction-to-Case) 4.1 4.3 4.3 4.3 4.3 4.7 4.9 5.3 θ CA (Case-to-Ambient -No Heatsink) 23 19 18 16 14 11 9 8 NOTES: 1. This table applies to a PQFP device soldered directly into board. 2. θ JA = θJC + θCA 3. θJL = 13°C/W (approx.) 4. θ JB = 13.5°C/W (approx.) θ JB θ JA θ JC θ JL θ CA |
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