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80960JD Datenblatt(PDF) 27 Page - Intel Corporation

Teilenummer 80960JD
Bauteilbeschribung  3.3 V EMBEDDED 32-BIT MICROPROCESSOR
PDF  59 Pages
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Hersteller  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

80960JD Datenblatt(HTML) 27 Page - Intel Corporation

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80960JD
PRODUCT PREVIEW
21
3.3
Thermal Management Accessories
The following is a list of suggested sources for 80960JD thermal solutions. This is neither an endorsement or a
warranty of the performance of any of the listed products and/or companies.
Heatsinks
1. Thermalloy, Inc.
2021 West Valley View Lane
Dallas, TX 75234-8993
(214) 243-4321 FAX: (214) 241-4656
2. Wakefield Engineering
60 Audubon Road
Wakefield, MA 01880
(617) 245-5900
3. Aavid Thermal Technologies, Inc.
One Kool Path
Laconia, NH 03247-0400
(603) 528-3400
Table 12. Maximum TA at Various Airflows in °C
Airflow-ft/min (m/sec)
fCLKIN (MHz)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.07)
PQFP
Package
TA without Heatsink
66
50
40
61
70
77
73
79
84
76
82
86
81
86
89
85
88
91
86
90
92
PGA
Package
TA without Heatsink
66
50
40
58
68
75
68
75
81
76
82
86
80
84
88
81
86
89
83
87
90
TA with Omni Heatsink
1
66
50
40
75
81
85
85
88
91
90
92
94
92
94
95
93
95
96
93
95
96
TA with Uni-directional
Heatsink2
66
50
40
73
79
84
86
90
92
90
92
94
92
94
95
93
95
96
93
95
96
1. 0.248” high omnidirectional heatsink (AI alloy 6061, 41mil fin width, 124 mil center-to-center fin spacing)
2. 0.250” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 146 mil center-to-center fin spacing)



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