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AT25QL128A Datenblatt(PDF) 81 Page - Dialog Semiconductor |
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AT25QL128A Datenblatt(HTML) 81 Page - Dialog Semiconductor |
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81 / 84 page ![]() 80 AT25QL128A DS-AT25QL128A–129E–01-2021 11.4 UI (21-WLCSP) NOTE: 1. CONTROLLING DIMENSION : MILLIMETER. 2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BUMPS. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BUMP DIAMETER, PARALLEL TO PRIMARY DATUM C. 4. SPECIAL CHARACTERISTICS C CLASS: c. 5. MINIMUM BUMP PITCH 0.500 mm. 6. THE PIN1 DOT LOCATED AT THE TOP (MARKING)/ BACK (BUMP) VIEW OF DIE IS BASED ON WAFER NOTCH AT THE BOTTOM. 7. BALL PLACEMENT USE Cyclomax 0.2 mm SOLDER BALL. 8. DEVICE NAME: QL128A. 9. DIMENSION FOR Øb for both the UBM and bump diameter. |
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