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PCIMX6S1CVM08AB Datenblatt(PDF) 1 Page - NXP Semiconductors

Teilenummer PCIMX6S1CVM08AB
Bauteilbeschribung  i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors
PDF  169 Pages
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Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCIMX6S1CVM08AB Datenblatt(HTML) 1 Page - NXP Semiconductors

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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SDLAEC
Rev. 9, 11/2018
Package Information
Plastic Package
BGA Case 2240 21 x 21 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 3
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products
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1
Introduction
The i.MX 6Solo/6DualLite automotive and infotainment
processors represent the latest achievement in integrated
multimedia-focused products offering high-performance
processing with a high degree of functional integration.
These processors are designed considering the needs of
the growing automotive infotainment, telematics, HMI,
and display-based cluster markets.
The processors feature advanced implementation of
single/dual Arm® Cortex®-A9 core, which operates at
speeds of up to 1 GHz. They include 2D and 3D graphics
processors, 1080p video processing, and integrated
power management. Each processor provides a 32/64-bit
DDR3/DDR3L/LPDDR2-800 memory interface and a
number of other interfaces for connecting peripherals,
such as WLAN, Bluetooth®, GPS, hard drive, displays,
and camera sensors.
i.MX 6Solo/6DualLite
Automotive and
Infotainment
Applications Processors
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .3
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
1.3
Updated Signal Naming Convention . . . . . . . . . . . .9
2
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2.1
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.1
Special Signal Considerations . . . . . . . . . . . . . . . .21
3.2
Recommended Connections for Unused Analog
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .23
4.1
Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . .23
4.2
Power Supplies Requirements and Restrictions . .33
4.3
Integrated LDO Voltage Regulator Parameters . . .34
4.4
PLL’s Electrical Characteristics . . . . . . . . . . . . . . .36
4.5
On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . .38
4.6
I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .39
4.7
I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . .44
4.8
Output Buffer Impedance Parameters . . . . . . . . . .49
4.9
System Modules Timing . . . . . . . . . . . . . . . . . . . . .52
4.10 General-Purpose Media Interface (GPMI) Timing .64
4.11 External Peripheral Interface Parameters . . . . . . .72
5
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . .134
5.1
Boot Mode Configuration Pins . . . . . . . . . . . . . . .134
5.2
Boot Device Interface Allocation . . . . . . . . . . . . .135
6
Package Information and Contact Assignments . . . . . .136
6.1
Updated Signal Naming Convention . . . . . . . . . .136
6.2
21x21 mm Package Information. . . . . . . . . . . . . .137
7
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163


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