MCF5373CAB180 datasheet(15/42 Pages) FREESCALE

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Preliminary Electrical Characteristics

MCF5373 ColdFire® Microprocessor Data Sheet, Rev. 0.3

Preliminary

Freescale Semiconductor

5.2

Thermal Characteristics

The average chip-junction temperature (TJ) in °C can be obtained from:

Eqn. 1

Where:

= Ambient Temperature, °C

QJMA

= Package Thermal Resistance, Junction-to-Ambient, °C/W

=PINT + PI/O

PINT

=IDD × IVDD, Watts - Chip Internal Power

PI/O

= Power Dissipation on Input and Output Pins — User Determined

Power supply must maintain regulation within operating EVDD range during instantaneous

and operating maximum current conditions. If positive injection current (Vin > EVDD) is greater

than IDD, the injection current may flow out of EVDD and could result in external power supply

going out of regulation. Insure external EVDD load will shunt current greater than maximum

injection current. This will be the greatest risk when the MCU is not consuming power (ex; no

clock). Power supply must maintain regulation within operating EVDD range during

instantaneous and operating maximum current conditions.

Table 5. Thermal Characteristics

Characteristic

Symbol

256MBGA

196MBGA

160QFP

Unit

Junction to ambient, natural convection

Four layer board

(2s2p)

JMA

261,2

NOTES:

JMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale

recommends the use of

JmA and power dissipation specifications in the system design to prevent device junction

temperatures from exceeding the rated specification. System designers should be aware that device junction

temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device

junction temperature specification can be verified by physical measurement in the customer’s system using the

parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.

Per JEDEC JESD51-6 with the board horizontal.

321,2

401,2

°C/W

Junction to ambient (@200 ft/min)

Four layer board

(2s2p)

JMA

231,2

291,2

361,2

°C/W

Junction to board

153

Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board

temperature is measured on the top surface of the board near the package.

203

253

°C/W

Junction to case

104

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

104

°C/W

Junction to top of package

21,5

Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is

written in conformance with Psi-JT.

21,5

°C/W

Maximum operating junction temperature

105

PD ΘJMA

()

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