TMP320C6720RFP300 datasheet(109/118 Pages) TI

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Mechanical Data

7.1 Package Thermal Resistance Characteristics

TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720

Floating-Point Digital Signal Processors

www.ti.com

SPRS370E – SEPTEMBER 2006 – REVISED JULY 2008

Table 7-1 and Table 7-2 provide the thermal characteristics for the recommended package types used on

the TMS320C672x DSP.

Table 7-1. Thermal Characteristics for GDH/ZDH Package

AIR FLOW

NO.

°C/W

(m/s)

Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB

Thermal Resistance Junction to Ambient

Thermal Resistance Junction to Board

14.5

Thermal Resistance Junction to Top of Case

ΨJB

Thermal Metric Junction to Board

ΨJT

Thermal Metric Junction to Top of Case

0.39

Table 7-2. Thermal Characteristics for RFP Package

THERMAL PAD CONFIGURATION

AIR

NO.

°C/W

FLOW

VIA

TOP

BOTTOM

(m/s)

ARRAY

Two-Signal, Two-Plane, 76.2 x 76.2 mm PCB(1)(2)(3)

Thermal Resistance Junction to Ambient

10.6 x 10.6 mm

6 x 6

7.5 x 7.5 mm

5 x 5

ΨJP

Thermal Metric Junction to Power Pad

10.6 x 10.6 mm

6 x 6

0.39

Double-Sided 76.2 x 76.2 mm PCB(1) (2)(4)

Thermal Resistance Junction to Ambient

10.6 x 10.6 mm

6 x 6

10.6 x 10.6 mm

38.1 x 38.1 mm

6 x 6

10.6 x 10.6 mm

57.2 x 57 mm

6 x 6

10.6 x 10.6 mm

76.2 x 76.2 mm

6 x 6

ΨJP

Thermal Metric Junction to Power Pad

10.6 x 10.6 mm

6 x 6

0.39

(1)

PCB modeled with 2 oz/ft2 Top and Bottom Cu.

(2)

Package thermal pad must be properly soldered to top layer PCB thermal pad for both thermal and electrical performance. Thermal pad

is VSS.

(3)

Top layer thermal pad is connected through via array to both bottom layer thermal pad and internal VSS plane.

(4)

Top layer thermal pad is connected through via array to bottom layer thermal pad.

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TMP320C6720RFP300 Datenblatt(PDF) 109 Page - Texas Instruments

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