74HC_HCT259

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 5 — 7 August 2012

18 of 22

NXP Semiconductors

74HC259; 74HCT259

8-bit addressable latch

Fig 17. Package outline SOT763-1 (DHVQFN16)

terminal 1

index area

0.5

1

A1

Eh

b

UNIT

y

e

0.2

c

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

3.6

3.4

Dh

2.15

1.85

y1

2.6

2.4

1.15

0.85

e1

2.5

0.30

0.18

0.05

0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT763-1

MO-241

- - -

- - -

0.5

0.3

L

0.1

v

0.05

w

0

2.5

5 mm

scale

SOT763-1

DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

16 terminals; body 2.5 x 3.5 x 0.85 mm

max.

A

A1

c

detail X

y

y1 C

e

L

Eh

Dh

e

e1

b

27

15

10

9

8

1

16

X

D

E

C

B

A

terminal 1

index area

A

C

C

B

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

02-10-17

03-01-27